QSXM Solder-down module: NXP i.MX8M Mini Quad

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Solder-down High Performance Module with Quad Core ARM Cortex-A53 processor

QSXM is a QFN-style solder-down system-on-module series with NXP’s QXSM i.MX8M Mini solder-down module with PCIequad-core i.MX8M Mini ARM Cortex-A53 64-bit processors, plus 2GB of 32-bit LPDDR4 RAM, 4GB eMMC Flash memory and power management.

This tiny SoM exploits the 108-pin compatible version of the QS-family pinout in order to expose the PCIe interface. It also features high bandwidth LPDDR4 RAM in order to maximize performance (when compared with QS8M).

The module is 29mm square, with a height of 2.6mm, and pin-compatible with other QS and QSX series modules. Its edge-contact QFN-type pinout style features a 1mm pitch with 108 pads providing unparalleled miniaturisation, thermal efficiency and EMI minimisation – the base functions as both a ground pad and a thermal conductor. The module requires a single 3.3v supply.

The QSXM module’s i.MX8M family processor provides a  quad core 1600MHz ARM Cortex-A53 processor complex as well as a separate GPU and Video Codec. The QSXM module offers all the features of QS8M, but performance is enhanced by 2GB of 32-bit LPDDR4 RAM, and the module’s slightly larger size and extra pins are used to expose the SoC’s PCIe interface.

The i.MX8M Mini makes for a cost-conscious module pricing and combines low energy operation with powerful features including MIPI-DSI display up to 1080p. The module offers an industrial temperature spec of  -25C to +85C and a wide range of connectivity including UART s, SPI, I²C, Audio, Gb Ethernet, SD, USB Host and Client and MIPI-DSI display.

The QSXM like other QSX series modules uses a QSBASE3 development system, which offers access to the PCIe interface via an M.2 port. The development kit (see tab below the feature table) comes with Linux installed.

To purchase a development kit simply follow the “Buy Online” link below.

pdf-iconDownload Datasheet and Pinout     Further downloadable documents will appear here.

ResourceQSXMDetail
ProcessorNXP i.MX8M Mini QuadDifferences from QS8M
CPU 4x ARM Cortex-A53Mini Quad
Processor Clock Max (MHz)1600Mini
RAM2GB32-bit LPDDR4
Persistent Storage4GB4GB eMMC
CoprocessorsGPU, VPU
Floating PointyARM Cortex-A53 Neon / VFP
Real-Time MCUyCortex-M4F subsystem
UART (RS232)3
PCIe11 Lane Gen.2
Gb Ethernet 1
I2C Interface2
LCD Controller1080pMIPI-DSI, 4-lane
Supplied LCD-Raspberry Pi compatible display connector
SAI Audio1
S/PDIF1
SD card/SDIO (4-bit)1
USB OTG2Hub on baseboard
SPI2
PWM1
JTAG1Special pads on base - refer to docs
Camera Interface1MIPI-CSI
RTC1
Temperature Range-25 to +85C
Dimensions29mm x 29mm2.6mm height
Power (mW)739/40Linux/Sleep
Connectors108-pin QFNQSX range compatible pinout
Longevity (years)12Guaranteed supply to 2033
Linux yMainline, Yocto Project compatible
QNXy7.0

QSBASE3 devkitQSX modules have their own development kit, built on the QSBASE3 baseboard, supplied with Linux running out of the box.

The development kit features a Raspberry Pi compatible expansion header and TFT interface – so you can implement interfaces in development using RPi hats and displays.

It is supplied with a QSXM module, with quad-core i.MX8M Mini, 2GB RAM and 4GB eMMC. There is MIPI-DSI connector for a touch screen, Gb Ethernet, 4x USB Host. USB 3.0 power, and debug UART. Additionally there is a 40-pin expansion header, and MIPI-CSI and PCIe via M.2 connectors on the rear. For production purposes, you will require a custom baseboard, and we are happy to offer baseboard design and manufacture as a service.

Solder-down module devkit

QSBASE4 with Raspberry Pi Display

All QS and QSX modules may use the QSBASE4 baseboard for development purposes.

QSBASE4 is designed to accept socketed versions of all QS and QSX modules, and features:

  • Gb Ethernet
  • 2-port USB hub
  • 2-Lane MIPI display connector – Raspberry Pi compatible
  • 2-Lane MIPI camera connector
  • Micro USB to UART bridge for debug
  • USB type-C connector for client/power
  • Expansion connector – RasPi power/I2C/SPI/UART compatible + CAN, SDIO
  • JTAG ICE headerQSBASE4 for solder-down modules in socketed form

Special socketed versions of QS/QSX modules are connected via two 80-pin push-down connectors.

The QSBASE4 works with a standard Raspberry Pi  7″ touch display which is readily obtainable (we may also have stock). It is supplied complete with a USB-C cable for power and flashing, and a micro USB-B cable for debugging. The socketed modules are preflashed with a Linux image (contact support for details, and possible customisation).

The QSXM module is available in production form on 500pcs reels (smaller quantities supplied as cut tape).

For development purposes either the dedicated devkit, or the socketed version of the module, plus a QSBASE4 development kit should be ordered. Links to the online shop are above, and the kits are in local (UK) inventory.

Simply order the QSXM development system via our online shop, using the “Buy Online” link to the right, and it should be with you in a couple of days. We look forward to providing you with knowledgeable, professional support to create your product. If you have questions, please don’t hesitate to contact us by calling Direct Insight on +44 1295 768800 9am to 5.30pm UK time, emailing info at directinsight.co.uk, or by using the “Contact Us” form below.

Contact our experienced team with your detailed questions – we’ll be happy to help.

You can quickly access volume pricing information using the “Get Quote” link to the right.

QSX vs QS solder-down SoM pinouts

The QSX pinout maintains pin-compatibility with QS, but adds high performance interfaces including PCIe

qsx solder-down pinout

For projects requiring PCIe or USB 3.0, QSX is an enlarged (29mm vs 27mm) version of the QS footprint, which maintains pin-compatibility as QS modules can be placed on the footprint, but adds 8 extra pins needed for USB 3.0 and/or PCIe where these interfaces are available.

In addition they offer:

  • Easy to achieve EMI compliance, thanks to integral ground plane
  • Unique ground pad design ensures alignment in 3 dimensions when soldering

  • Simple PCB layout, production and inspection thanks to edge-located pads