QSMP-13 Extra-Low-Cost Solder-down Module with STMicro STM32MP135C

Tiny QFN-Style System-on-Modules with 650MHz ARM Cortex-A7 processor

With a low unit price, QSMP-13 is a highly cost-effective 27mm x 27mm QFN Style solder-down system-on-module with STMicro’s qsmp-13 low cost module with STM32MP135Clatest STM32MP135C ARM Cortex-A7 processor clocked at 650MHz, plus RAM, Flash memory and power management. QSMP is a sub family of modules based on STM32MP1 processors sitting within the Ka-Ro QS-Module pin-compatible family, which also includes SoMs based on STM32MP2, not to mention STM32MP157C modules with optional radio as well as NXP and Renesas processors. The module is square, with a height of 2.3mm. Its QFN-type pinout style features a 1mm pitch with 100 edge-located pads providing unparalleled miniaturisation, thermal efficiency and EMI minimisation – the base functions as both a ground pad and a thermal conductor. The module requires a single 3.3v supply.

The QSMP module’s STM32MP1 family processor allows us to offer both high performance (QSMP-15) via the STM32MP157A with dual 650MHz ARM Cortex-A7 core and GPU, and very low cost (QSMP-13) thanks to the STM32MP135C single core version. QSMP-13 features 256MB DDR3L RAM, 4GB eMMC Flash, and a good range of interfaces (see table).  The module offers an extended temperature spec of   -25C to +85C. Wide-ranging connectivity including CANbus, UART (x3), SPI (x2), I2C (x2), Audio, Gb Ethernet, SD, USB Host and Client and a parallel display.

QSMP-13 comes with a dedicated development system, equipped with Linux BSP.

To purchase a development kit simply follow the “Buy Online” link below.

pdf-iconDownload Datasheet and Pinout

ResourceQSMP-13QSMP-15Detail
ProcessorST Micro STM32MP135CST Micro STM32MP157Clow cost or high performance
CPU1x ARM Cortex-A72x ARM Cortex-A7includes Neon SIMD / VFP
Processor Clock Max (MHz)650650
Microcontroller-ARM Cortex-M4
RAM (MB)256256 / 512DDR3L, see comparison tab below
Persistent Storage4GB4GB
Floating PointyyARM Cortex-A7 Neon VFP
UART (RS232)53
Ethernet Gbe11
I2C Interface22
LCD Controller1124bpp, 1366x768
RGB displayyy
MIPI-DSI display-y
Audio11SAI
SD card/SDIO (4-bit)114-wire, SD Card receptacle on baseboard
USB Host11Single "A" type socket on baseboard
USB Client/OTG11
SPI22
CAN22
Wi-Fi-optionMurata 2AE
Bluetooth-option5.2
secure boot / cryptoyy
Temperature Range-25C to +85C-25C to +85C-40C Wi-Fi/BT version
Dimensions27mm x 27mm27mm x 27mmdepth 2.3mm
Power Consumptionaround 500mWaround 500mW15mW sleep
LinuxyyYocto Scarthgap - LTS Kernel

solder-down qfn module STM32M1 devkitThe QSMP module has its own development kit called QSBASE1, and also works with the universal QSBASE4 kit which supports those QS modules with MIPI-DSI display interface. Both are supplied with Linux running out of the box.

QSBASE1

The QSBASE1 development kit is supplied with a QSMP-15 OR QSMP-13 module. There is an RGB connector for a touch screen (which can be optionally purchased), and connectors for SD Card, Gb Ethernet, USB Host. USB Power supply, and debug UART. All 100 module pins are brought to 0.1″ solder pads.

QSBASE4

Solder-down module devkit

QSBASE4 with Raspberry Pi Display

Most QS and QSX modules may use the QSBASE4 baseboard for development purposes. However, since the QSMP-1351 lacks a MIPI-DSI display interface, it is only supported by QSBASE4 for headless operation.

QSBASE4 is designed to accept socketed versions of all QS and QSX modules, and features:

  • Gb Ethernet
  • 2-port USB hub
  • 2-Lane MIPI display connector – Raspberry Pi compatible
  • 2-Lane MIPI camera connector
  • Micro USB to UART bridge for debug
  • USB type-C connector for client/power
  • Expansion connector – RasPi power/I2C/SPI/UART compatible + CAN, SDIO
  • JTAG ICE headerQSBASE4 for solder-down modules in socketed form

Special socketed versions of QS/QSX modules are connected via two 80-pin push-down connectors.

The QSBASE4 works with a standard Raspberry Pi  7″ touch display which is readily obtainable (we may also have stock). It is supplied complete with a USB-C cable for power and flashing, and a micro USB-B cable for debugging. The socketed modules are preflashed with a Linux image (contact support for details, and possible customisation).

The QSMP-13 module is available in the configuration below. See the comparison table below (also the feature table above) for options including QSMP-15.

ST32M1 comparison

ProcessorPart #Module SKUCoresRAMDevKitCANbusGPU+MIPI displayTemp Spec.
STM32MP135CQSMP/135C/256S/4GF/E85QSMP-1351Single256MBQSMP-13 QSBASE1 Evalkit
y--25C to +85C
STM32MP157CQSMP/157C/256S/4GF/E85QSMP-1530CDual256MBQSMP-15 QSBASE1 Evalkit or QSBASE4yy-25C to +85C
STM32MP157CQSMP/157C/512S/4GF/E85QSMP-1570Dual512MBQSMP-15 QSBASE1 Evalkit or QSBASE4yy-25C to +85C

QSMP-1351 – with  STM32MP135C single-core processor, 256MB RAM, 4GB eMMC Flash, -25C to +85C  industrial temp
Simply order the QSMP development system via our online shop, using the “Buy Online” link to the right, and it should be with you in a couple of days. We look forward to providing you with knowledgeable, professional support to create your product. If you have questions, please don’t hesitate to contact us by calling Direct Insight on +44 1295 768800 9am to 5.30pm UK time, emailing info at directinsight.co.uk, or by using the “Contact Us” form below.

QSMP datasheet

QSMP-13 datasheet

Contact our experienced team with your detailed questions – we’ll be happy to help.

You can quickly access volume pricing information using the following link: Get Quote

Development kits and sample/spare modules are available from stock

QSBASE4 development kit recommended for QSMP-15 (requires QSMP157A socketed module)

QSBASE1 with QSMP-13 development kit recommended for QSMP-13

QSBASE1 with QSMP-15

QSBASE2 with QSMP-15

QFN-Style SoM Advantages

For larger volume applications, or where a tiny footprint is needed, Ka-Ro QFN solder-down modules fit the bill perfectly.

solder down module pinout

In addition they offer:

  • Easy to achieve EMI compliance, thanks to integral ground plane
  • Unique ground pad design ensures alignment in 3 dimensions when soldering

  • Simple PCB layout, production and inspection thanks to edge-located pads