QS8M Solder-down module with NXP i.MX8M Mini Quad and Nano Dual

KaRo

QFN Style System-on-Module with Quad or Dual Core ARM Cortex-A53 processors

The new QS8M is a QFN Style solder-down system-on-module series with NXP’s solder-down i.MX8 modulelatest dual and quad-core i.MX8M Mini and Nano ARM Cortex-A53 64-bit processors, plus RAM, Flash memory and power management. The module is square, and just 27mm in width, with a height of 2.3mm. Its QFN-type pinout style features a 1mm pitch with 100 pads providing unparalleled miniaturisation, thermal efficiency and EMI minimisation – the base functions as both a ground pad and a thermal conductor. The module requires a single 3.3v supply.

The QS8M module’s i.MX8M family processor provides a dual core – in the case of i.MX8M Nano, or quad core for i.MX8M Mini 1400/1600MHz ARM Cortex-A53 processor complex as well as a separate GPU and Video Codec (Mini only). There is up to 1GB of DDR3L RAM, and 4GB eMMC Flash, with an extensive range of interfaces (see table).  The i.MX8M Nano and Mini combine low energy operation with powerful features including MIPI-DSI display up to 1080p.  Both modules offer an industrial temperature spec of  -25C to +85C. The modules provides a wide range of connectivity including CANbus , UART s, SPI, I²C, Audio, Ethernet, SD, USB Host and Client and MIPI-DSI display.

The QS8M series offers a dedicated development system, equipped with Linux BSP (Windows 10 IoT and QNX also available)

To purchase a development kit simply follow the “Buy Online” link below.

pdf-iconDownload Datasheet and Pinout

ResourceQS8MDetail
ProcessorNXP i.MX8M Mini Quad or Nano Dual
CPU 2/4x ARM Cortex-A53Nano Dual or Mini Quad
Processor Clock Max (MHz)1400/1600Nano/Mini
RAM (MB)512/1024Nano/MIni
Persistent Storage4GB4GB eMMC
CoprocessorsGPU, VPUVPU on Mini only
Floating PointyARM Cortex-A53 Neon / VFP
Real-Time MCUyCortex-M4F/M7 subsystem
UART (RS232)3
Gb Ethernet 1
I2C Interface2
LCD Controller1080pMIPI-DSI, 4-lane
Supplied LCD1280 x 80010.1" capacitive touch with TX8MDK.
SAI Audio1
S/PDIF1
SD card/SDIO (4-bit)1
USB OTG2/1Mini/Nano. Hub on baseboard
SPI2
PWM1
JTAG1Special pads on base - refer to docs
Camera Interface1MIPI-CSI
RTC1
Temperature Range-25 to +85C
Dimensions27mm x 27mm2.3mm height
Power510/60 (500/45)Power/Sleep Mini (Nano)
Connectors100-pin QFNQS range compatible pinout
Longevity (years)12Guaranteed supply to 2033
Linux yMainline, Yocto Project compatible
QNXy7.0
Windows 10 IoT CoreTBA

QS8M devkit rpi compatibleThe QS8M module has its own development kit, supplied with Linux running out of the box.

The development kit features a Raspberry Pi compatible expansion header and TFT interface – so you can implement interfaces in development using RPi hats and displays.

It is supplied with a QS8M-MQ00 module, with quad-core i.MX8M Mini, 1GB RAM and 4GB eMMC. There is MIPI-DSI connector for a touch screen , MIPI-CSI camera port, and connectors for SD Card, Gb Ethernet, 4x USB Host. USB client and power supply, and debug UART. Additionally there is a 40-pin expansion header and all 100 module pins are brought to 0.1″ solder pads. For production purposes, you will require a custom baseboard, and we are happy to offer baseboard design and manufacture as a service.

Solder-down module devkit

QSBASE4 with Raspberry Pi Display

All QS and QSX modules may use the QSBASE4 baseboard for development purposes.

QSBASE4 is designed to accept socketed versions of all QS and QSX modules, and features:

  • Gb Ethernet
  • 2-port USB hub
  • 2-Lane MIPI display connector – Raspberry Pi compatible
  • 2-Lane MIPI camera connector
  • Micro USB to UART bridge for debug
  • USB type-C connector for client/power
  • Expansion connector – RasPi power/I2C/SPI/UART compatible + CAN, SDIO
  • JTAG ICE headerQSBASE4 for solder-down modules in socketed form

Special socketed versions of QS/QSX modules are connected via two 80-pin push-down connectors.

The QSBASE4 works with a standard Raspberry Pi  7″ touch display which is readily obtainable (we may also have stock). It is supplied complete with a USB-C cable for power and flashing, and a micro USB-B cable for debugging. The socketed modules are preflashed with a Linux image (contact support for details, and possible customisation).

The QS8M module is available in two standard configurations, with further options based on MOQ. See the comparison table below (also the feature table above), and the part descriptions below the table.

QS8M i.MX8M MiniQS8M i.MX8M Nano
Primary Processors4x ARM Cortex-A532x ARM Cortex-A53
Clock1.6GHz1.4GHz
Secondary ProcessorARM Cortex-M4FARM Cortex-M7
RAM1GB512MB
USB 2.021
Video Codec1080p60-
GPUOpenGLES 2.0, single shaderOpenGLES 3.1, OpenCL 1.2, Vulkan, dual shaders

QS8M-MQ00 – with  i.MX8M Mini quad-core processor, 1GB RAM, 4GB eMMC Flash, -25C to +85C  industrial temp – available in packs of 10
QS8M-ND00 – with i.MX8M Nano dual-core processor, 512MB RAM, 4GB eMMC Flash, -25C to +85C  industrial temp – available in packs of 10
Available MOQ options include 256MB RAM, and full industrial temp range (-40C)

Simply order the QS8M development system via our online shop, using the “Buy Online” link to the right, and it should be with you in a couple of days. We look forward to providing you with knowledgeable, professional support to create your product. If you have questions, please don’t hesitate to contact us by calling Direct Insight on +44 1295 768800 9am to 5.30pm UK time, emailing info at directinsight.co.uk, or by using the “Contact Us” form below.

QS8M datasheet

Contact our experienced team with your detailed questions – we’ll be happy to help.

You can quickly access volume pricing information using the following link: Get Quote

Development kits and sample/spare modules are available from stock

QSBASE4 development kit  (requires QS8MM socketed module, or QS8MN socketed module)

QSBASE2 with QS8M Nano Dual

QSBASE2 with QS8M Mini Quad

QFN-Style SoM Advantages

For larger volume applications, or where a tiny footprint is needed, Ka-Ro QFN solder-down modules fit the bill perfectly.

solder down module pinout

In addition they offer:

  • Easy to achieve EMI compliance, thanks to integral ground plane
  • Unique ground pad design ensures alignment in 3 dimensions when soldering

  • Simple PCB layout, production and inspection thanks to edge-located pads